ra8-firmware 0.1.0
Bare-metal firmware for the Renesas RA8 family (RA8D2 / RA8P1)
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ra8_tsn_config_t Struct Reference

Configuration descriptor for ra8_tsn_init. More...

#include <ra8_tsn.h>

Data Fields

ra8_tsn_cal_temp_t high_ref_degc
 105 or 125 degC.
ra8_tsn_cal_temp_t low_ref_degc
 Always -40 degC on RA8D2.
uint16_t stab_us
 tTSTBL in microseconds.

Detailed Description

Configuration descriptor for ra8_tsn_init.

  • high_ref_degc selects which calibration temperature was used at factory shipment. Pass k_ra8_tsn_cal_temp_high_125 for Tj_max = 125 degC parts and k_ra8_tsn_cal_temp_high_105 for Tj_max = 95 / 105 degC parts (HUM Ch 55.3.1 p 3499-3500).
  • low_ref_degc is always k_ra8_tsn_cal_temp_low_n40 for the RA8D2 family and is captured here so the conversion math stays self-documenting.
  • stab_us is the busy-wait observed after asserting TSCR.TSEN before the sensor output is valid. HUM Figure 55.2 (p 3502) names this tTSTBL = 30 us; callers may bump the value to absorb extra slack on slow boards but must not go below 30.

Definition at line 121 of file ra8_tsn.h.

Field Documentation

◆ high_ref_degc

ra8_tsn_cal_temp_t ra8_tsn_config_t::high_ref_degc

105 or 125 degC.

Definition at line 122 of file ra8_tsn.h.

Referenced by internal_validate_cfg(), and ra8_tsn_init().

◆ low_ref_degc

ra8_tsn_cal_temp_t ra8_tsn_config_t::low_ref_degc

Always -40 degC on RA8D2.

Definition at line 123 of file ra8_tsn.h.

Referenced by internal_validate_cfg(), and ra8_tsn_init().

◆ stab_us

uint16_t ra8_tsn_config_t::stab_us

tTSTBL in microseconds.

Definition at line 124 of file ra8_tsn.h.

Referenced by internal_validate_cfg(), and ra8_tsn_init().


The documentation for this struct was generated from the following file: